Usually the clock board requires a high accuracy voltage reference, the solution is to add a high accuracy voltage reference chip on the clock design, but this will cost-up the clock. Another solution is to obtain the voltage reference from the voltage reference terminal of OCXO. Since the voltage reference OCXO is usually placed in a constant temperature of the place, and OCXO accuracy of the thermostat bath temperature is usually 0.1℃, so it further mitigates the voltage reference sensitivity to temperature change. It is always recommended to take OCXO voltage reference terminal as the clock voltage reference.
Please note the load current at voltage referential terminal should be less than 1mA.
To jumper a 10~100uF tantalum capacitor or ceramic capacitor at the power input terminal of crystal oscillator, if the power supply voltage is lower, or PCB wiring is getting thinner, the capacitance of capacitor should be increased respectively so as to decrease the ripple interference. In addition, at the power input of crystal oscillator, a 0.01uF ceramic decoupling capacitor should also be jumpered, we recommend the way of "connection on the same layer", it mustn’t be connected through the hole in the power supply layer and the ground layer.
As for OCXO product, the power of supply system must be greater than the startup power of OCXO, and reserve a certain of excess.
OCXO TCXO/MCXO/VCXO/OSC
Sinewave Square Wave
Clipped Sinewave (LV)PECL
In considering of PCB layout, the basic principle follows as: Try to avoid input line and output line adjacent in parallel of generating reflection interference To consider the noise originated from the power and ground cables, add a decoupling capacitance, to widen the power supply and ground cables; The width of cable is accordance with the rule: Ground cable> Power cable> Signal cable, and try to use large area copper layer as ground cable. To consider signal cross-interference, keep it away from the ground line, remove the cross-interference or shield the interference signal. Try to assure of integrity of the ground layer
In consideration of layout: Try to solder the crystal oscillator on PCB as far as possible, reduce use of DIP as possible; Try to keep the high-frequency signal line as possible away from the sensitive analog circuit devices Try to keep a terminal grounded for connection of digital ground and analog ground, or connect through an external interface (eg. socket).